Research Experiences:

• Design and fabrication of Printed Circuit Boards (PCB) and Microfluidic Devices for electrowetting actuations.
• Design and fabrication of  PCB-based Resistive Thermal Devices (RTD) for measuring temperature in Microfluidic Devices.
• Design and fabrication of PCB-based Microfluidic Devices for thermocapillary actuations.
• Development of an in-house numerical code to simulate Hot-Spot cooling including electrowetting
• Development of an in-house numerical code to simulate the impact and solidification of full/semi-molten metal droplets on cold substrates for thermal spray processes
• Setting-up experiments for high-speed imaging of droplet impacts, droplet evaporation, contact angle measurement and electrowetting